Shanghai Neardi Technology Co., Ltd. sales@neardi.com +86 17612192553
Product Details
Place of Origin: Shanghai, China
Brand Name: Neardi
Model Number: LCB3399pro
Document: LCB3399Pro System On Module....0.pdf
Payment & Shipping Terms
Minimum Order Quantity: 1 piece
Price: Negotiable
Packaging Details: 33.5×19×9 cm
Delivery Time: 7 days
Payment Terms: L/C,D/A,D/P,T/T
Supply Ability: 10000/pieces/mon
SoC: |
RK3399Pro |
Supplier Type: |
OEM/ODM |
CPU: |
2 * Cortex-A72 + 4 * Cortex-A53 |
GPU: |
Mali-T860MP4 GPU |
NPU: |
3 TOPS |
VPU: |
4K/1080P |
DDR: |
LPDDR4, 3GB/6GB (Optional) |
EMMC: |
EMMC 5.1, 16GB/64GB (Optional) |
Working Temperature: |
Enterprise Grade: -20°C To 70°C; Industrial Grade: -40°C To 85°C |
PCB Interface: |
B2B, 240 Pin |
Embedded: |
Yes |
OS: |
Android / Ubuntu / Buildroot / Debian |
Application: |
Smart Home And Retail |
SoC: |
RK3399Pro |
Supplier Type: |
OEM/ODM |
CPU: |
2 * Cortex-A72 + 4 * Cortex-A53 |
GPU: |
Mali-T860MP4 GPU |
NPU: |
3 TOPS |
VPU: |
4K/1080P |
DDR: |
LPDDR4, 3GB/6GB (Optional) |
EMMC: |
EMMC 5.1, 16GB/64GB (Optional) |
Working Temperature: |
Enterprise Grade: -20°C To 70°C; Industrial Grade: -40°C To 85°C |
PCB Interface: |
B2B, 240 Pin |
Embedded: |
Yes |
OS: |
Android / Ubuntu / Buildroot / Debian |
Application: |
Smart Home And Retail |
The LCB3399Pro is a high-performance core module engineered around Rockchip’s RK3399Pro platform, featuring a compact 75mm × 55mm design. It connects to the baseboard through two Tyco/AMP 0.8mm pitch dual-row 140-pin board-to-board connectors and is secured with four M3 screws, ensuring a stable, reliable connection that simplifies installation and maintenance.
This module integrates key components, including a CPU with an NPU, LPDDR3 RAM, eMMC storage, and a PMU. The RK3399Pro processor powers the system, while dual-channel LPDDR3 (64-bit) memory enhances performance with lower power consumption and support for 3GB/6GB configurations. The eMMC 5.1 standard provides high-speed storage, ranging from 4GB to 128GB. Power management is handled by the RK809 PMU, along with multiple DC-DC converters and LDO components, supporting DVFS (Dynamic Voltage and Frequency Scaling) for optimized power efficiency.
To ensure long-term reliability, the LCB3399Pro undergoes rigorous testing, covering:
• Power performance (voltage accuracy, ripple, overshoot, rise/fall time, dynamic range)
• Power sequencing of various voltages
• Clock signal accuracy and frequency deviation
• Full-load power consumption and temperature rise
Designed with a modular architecture, the LCB3399Pro serves as a fully functional, pre-validated core module, allowing businesses to build products efficiently while minimizing development time, cost, and risk. This approach accelerates mass production and enhances overall project success.
Function | Description |
CPU | RK3399Pro; dual-core Cortex-A72 + quad-core Cortex-A53 architectural processor. |
GPU |
Mali-T860MP4 GPU, supporting OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DirectX 11; supports AFBC (Advanced Frame Buffer Compression). |
NPU | 3 TOPS computational power; supports 8-bit/16-bit operations; compatible with TensorFlow and Caffe models. |
VPU | Capable of 4K VP9 and 4K 10-bit H265/H264 video decoding, up to 60fps at 1080P; multi-format video decoding (WMV, MPEG-1/2/4, VP8); 1080P video encoding, supporting H.264 and VP8 formats |
DDR | LPDDR4/LPDDR4X, with options for 3GB or 6GB. |
eMMC | eMMC 5.1, with options for 16GB,64GB |
PMU | RK806 |
Camera Interface | Two ISP built-in Dual MIPI-CSI 4 Lane of 1.5 Gbps/Lane ITU-R BT 601/656 compliant Maximum input resolution of one ISP is 14M pixels |
Display Interface | Two VOP embedded Dual MIPI-DSI 4 Lane of 1.5 Gbps/Lane up to 2560x1600@60fps eDP1.3 4 Lane of 2.7/1.62 Gbps/lane DP1.2 4 Lane with HDCP2.2 up to 4kx2k at 60Hz resolution HDMI2.0 3 Lane with HDCP2.2 |
USB Interface | OTG*1,HOST*2,TYPE-C*2 |
TYPE-C Interface | Dual Type-C PHY with Type-C V1.1 and USB PD2.0 Attach/detach detection and signaling as DFP, UFP, and DRP Support USB3.0 Type-C and DisplayPort 1.2 Alt Mode Up to 5Gbps data rate for USB3.0 Up to 5.4Gbps (HBR2) data rate for DP1.2 |
Audio Interface | Three I2S/PCM built-in SPDIF supported Audio resolution from 16 bits to 32 bits Sample rate up to 192KHz Provides master and slave work mode, software configurable Support 3 I2S formats (normal, left-justified, right-justified) Support 4 PCM formats (early, late1, late2, late3) Support two 16-bit audio data stores together in one 32-bit wide location Support 16, 20, 24 bits audio data transfer in linear PCM mode |
Connectivity | Compatible with SDIO 3.0 protocol GMAC 10/100/1000M Ethernet Controller Six on-chip SPI controllers Five on-chip UART controllers inside Nine on-chip I2C controllers Five groups of GPIO (GPIO0~GPIO4), totally have 122 GPIOs One PCIe port compatible with PCI Express V2.1 and dual operation mode (RC and EP), Six-channel single-ended 10-bit SAR-ADC up to 1MS/s sampling rate |
OS | Android / Ubuntu / Buildroot / Debian |
PCB interface | B2B(280 Pin 0.8mm Pitch) |
PCB size | L* W *H(mm):75 *55 * 7.8(PCB thickness 1.2mm) |
Wiki Documentation: | http://wiki.neardi.net/docs/welcome |
GitHub: | https://github.com/neardiGitLab: https://gitlab.com/neardiSDK |
Repository: | https://gitlab.com/neardi-linux |
Forum: | https://forum.neardi.com |
Video Tutorials: | https://www.youtube.com/@neardichannels |
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